Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the processes for selecting the first three research and development (R&D) facilities funded through the CHIPS and Science Act. The facilities include a NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility, a NSTC Administrative and Design Facility, and a NSTC Extreme Ultraviolet (EUV) Center. The Department and Natcast expect to announce information at a later date about the process for selecting affiliated technical centers.
As part of President Biden’s Investing in America agenda, CHIPS for America investments are targeted to help build vibrant semiconductor ecosystems in the U.S. that bolster cutting-edge R&D and create quality jobs. Bridging the gap between research and industry is a key component to realizing this agenda and ensuring that CHIPS for America will be an enduring success. The CHIPS R&D facilities will facilitate this by convening partners across the semiconductor ecosystem to ensure technological advances in semiconductor design and manufacturing can transfer at scale to commercialization. This approach showcases the U.S.’ commitment to secure and lead in domestic semiconductor manufacturing, packaging, and research for decades to come.
“To reclaim America’s semiconductor leadership, we can’t just invest in manufacturing capacity, we also need to supercharge our research and development ecosystem. The National Semiconductor Technology Center and National Advanced Packaging Manufacturing Program are critical components in making that happen, and with the facilities CHIPS for America will be funding we will drive innovation and help recruit and train the next generation of American semiconductor workers,” said Secretary of Commerce Gina Raimondo.
“The CHIPS R&D facilities launch is an exciting milestone in the implementation of President Biden’s CHIPS & Science Act. This will he ..
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